High frequency press

During the high-frequency-bonding the workpiece is exposed to a high-frequency stress field. The water-molecules in this field are being stimulated to oscillate, similar to the principle of a microwave. The high content of humidity lead to a faster heating and evaporation of the water and by that, to a faster hardening of the glue. The wood in use (solid wood and wood material) has to show a smaller humidity between 5-12% to be suitable for the process. As with higher humidities too much energy becomes lost due to the heating of the wood and by the raised temperature tensions are created within the wood.

Comparison to conventional technical methods

Pros

  • hardens about twice as fast as if done with warm water
  • no post-curing, the whole joint is hardened directly after pressing
  • reduction of the danger of cracking and deforming by little warming of the wood
  • especially effective with thick boards

Cons

  • high safety requirements, health risk in case of inobservance
  • small tolerance ranges of the wood moisture: only suitable for well dryed lumber

Usual abbreviations

HF high frequency

Alternative processes