High frequency pressDuring the high-frequency-bonding the workpiece is exposed to a high-frequency stress field. The water-molecules in this field are being stimulated to oscillate, similar to the principle of a microwave. The high content of humidity lead to a faster heating and evaporation of the water and by that, to a faster hardening of the glue. The wood in use (solid wood and wood material) has to show a smaller humidity between 5-12% to be suitable for the process. As with higher humidities too much energy becomes lost due to the heating of the wood and by the raised temperature tensions are created within the wood. Comparison to conventional technical methodsPros
Cons
Usual abbreviations
Alternative processes
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